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| HA17324A Series Quad Operational Amplifier ADE-204-031B (Z) Rev.2 May 2001 Description HA17324A series are quad operational amplifier that provide high gain and internal phase compensation, with single power supply. They can be widely used to control equipments. Features * Wide range of supply voltage, and single power supply used * Internal phase compensation * Wide range of common mode voltage, and possible to operate with an input about 0 V * Low electro-magnetic susceptibility level Measurement Condition Rf Vcc = +7.5 V Vee = -7.5 V Rs Rs Rf 0.01 Vin -10 dBm RF signal source (for quasi-RF noise) Vout V (= 100Vio) _ 5.0 Output Offset Voltage vs. Input Interference Output offset voltage (arb. unit) - + 4.0 3.0 2.0 1.0 0 -1.0 100E+3 HA17324A series HA17324 series Improvement 1E+6 10E+6 100E+6 1E+9 Input RF frequency (Hz) 10E+9 HA17324A Series Ordering Information Type No. HA17324A HA17324AF HA17324ARP Application Commercial use Package DP-14 FP-14DA FP-14DN Pin Arrangement Vout1 Vin(-)1 Vin(+)1 VCC Vin(+)2 Vin(-)2 Vout2 1 2 3 4 5 6 7 (Top view) -+ 2 +- 3 1 -+ 4 +- 14 Vout4 13 Vin(-)4 12 Vin(+)4 11 VEE 10 Vin(+)3 9 8 Vin(-)3 Vout3 Circuit Schematic (1/4) Q5 Vin(-) Q1 Q2 Q3 Q4 Q6 C Q7 R1 Vin(+) Q11 Q10 Q8 Q9 Q12 Q13 Vout Rev.2, May 2001, page 2 of 10 HA17324A Series Absolute Maximum Ratings (Ta = 25C) Item Supply voltage Sink current Power dissipation Common mode input voltage Differential input voltage Operating temperature Storage temperature Symbol VCC Isink PT VCM Vin (diff) Topr Tstg Ratings 32 50 625 * VCC -40 to +85 -55 to +125 1,2 Unit V mA mW V V C C -0.3 to VCC Notes: 1. For the DILP package. This is the allowable values up to Ta = 50C. Derate by 8.3 mW/C. 2. For the SOP package. Tjmax = j-a * PCmax + Ta (j-a; Thermal resistor between junction and ambient at set board use). The wiring density and the material of the set board must be chosen for thermal conductance of efficacy board. And PCmax cannot be over the value of PT. 240 220 Thermal resistor j-a (C) 40 mm a b 200 180 160 140 120 100 80 0.5 1 2 5 10 Thermal conductance of efficacy board (W/m C) 20 SO P1 4- SO P1 4- wi 1.5 t epoxy th co mp ou no nd co mp o un a. Class epoxy board of 10% wiring density b. Class epoxy board of 30% wiring density d Rev.2, May 2001, page 3 of 10 HA17324A Series Electrical Characteristics (VCC = +15 V, Ta = 25C) Item Input offset voltage Input offset current Input bias current Power source rejection ratio Voltage gain Common mode rejection ratio Common mode input voltage range Maximum output voltage Output source current Output sink current Supply current Slew rate Channel separation Output sink current Symbol VIO IIO IIB PSRR AVD CMR VCM Vop-p Iosource Iosink ICC SR CS Iosink Iosink Output voltage VOH VOH Output voltage VOL VOL Min 75 -0.3 20 10 15 3 13.2 12.0 Typ 2 5 30 93 90 80 13.6 40 20 0.8 0.19 120 50 9 13.6 13.3 0.8 1.1 Max 7 50 500 13.5 2 1.0 1.8 Unit mV nA nA dB dB dB V V mA mA mA V/s dB A mA V V V V Test Conditions VCM = 7.5 V, RS = 50 , Rf = 50 k VCM = 7.5 V, IIO = | II (-) - II (+) | VCM = 7.5 V f = 100 Hz, RS = 1 k, Rj = 100 k RS = 1 k, Rf = 100 k, RL = RS = 50 , Rf = 5 k RS = 1 k, Rf = 100 k, f = 100 Hz f = 100 Hz, RS = 1 k, Rf = 100 k, RL = 20 k VIN = 1 V, VIN = 0 V, VOH = 10 V VIN = 0 V, VIN = 1 V, VOL = 2.5 V VIN = GND, RL = f = 1.5 kHz, VCM = 7.5 V, RL = f = 1 kHz VIN = 0 V, VIN = 1 V, VOL = 200 mV VIN = 0 V, VIN = 1 V, VOL = 1 V IOH = -1 mA IOH = -10 mA IOL = 1 mA IOL = 10 mA + - + - + - Rev.2, May 2001, page 4 of 10 HA17324A Series Characteristic Curves Output source current Iosource (mA) Output Source Current vs. Ambient Temperature 80 VCC = 15 V 70 VOH = 10 V 60 50 40 30 20 10 0 -20 0 20 40 60 Ambeint temperature Ta (C) 80 Input Bias Current vs. Ambient Temperature 80 Input bias current IIB (nA) 70 60 50 40 30 20 10 0 -20 VCC = 15 V VCM = 7.5 V 0 20 40 60 Ambeint temperature Ta (C) 80 Supply Current vs. Supply Voltage 4 Input Bias Current vs. Supply Voltage 80 3 Input bias current IIB (nA) Ta = 25C Ta = 25C Supply current ICC (mA) 60 2 40 1 20 0 8 16 24 32 Supply voltage VCC (V) 40 0 8 16 24 32 Supply voltage VCC (V) 40 Voltage Gain vs. Supply Voltage Maxlmum Output Voltage vs. Frequency Maximum output voltage VOP-P (V) 160 20 16 12 8 4 0 1k VCC = 15 V Ta = 25C RL = 20 k Voltage gain AVD (dB) Ta = 25C RL = 120 80 40 0 8 16 24 32 Supply voltage VCC (V) 40 3k 10 k 30 k 100 k 300 k Frequency f (Hz) 1M Rev.2, May 2001, page 5 of 10 HA17324A Series Voltage Gain vs. Frequency 120 100 Voltage gain AVD (dB) VCC = 15V Ta = 25C RL = 80 60 40 20 0 1 3 10 30 100 300 1k 3k Frequency f (Hz) 10 k 30 k 100 k 300 k 1M Common Mode Rejection Ratio vs. Frequency 120 Common mode rejection ratio CMR (dB) 100 VCC = 15V Ta = 25C RS = 50 80 60 40 20 0 100 300 1k 3 k 10 k 30 k 100 k 300 k Frequency f (Hz) 1M Rev.2, May 2001, page 6 of 10 HA17324A Series Solder Mounting Method 1. Small and light surface-mount packages require spicial attentions on solder mounting. On solder mounting, pre-heating before soldering is needed. The following figure show an example of infrared rays refow. 2. The difference of thermal expansion coefficeient between mounted substrates and IC leads may cause a failure like solder peeling or soler wet, and electrical characteristics may change by thermal stress. Therefore, mounting should be done after sufficient confirmation for especially in case of ceramic substrates. Temperature 235C Max 140 to 160C 60 s 1 to 5C/s 10 s Max 1 to 4C/s Time (s) Figure 1 An Example of Infrared Rays Reflow Conditions Rev.2, May 2001, page 7 of 10 HA17324A Series Package Dimensions Unit: mm 19.20 20.32 Max 14 8 1 2.39 Max 1.30 7 7.62 6.30 7.40 Max 0.51 Min 2.54 Min 5.06 Max 2.54 0.25 0.48 0.10 0.25 - 0.05 0 - 15 + 0.10 Hitachi Code JEDEC EIAJ Mass (reference value) DP-14 Conforms Conforms 0.97 g Unit: mm 10.06 10.5 Max 14 8 1 7 5.5 *0.22 0.05 0.20 0.04 2.20 Max 0.20 7.80 + 0.30 - 1.42 Max 1.15 0 - 8 1.27 *0.42 0.08 0.40 0.06 0.10 0.10 0.70 0.20 0.15 0.12 M Hitachi Code JEDEC EIAJ Mass (reference value) FP-14DA -- Conforms 0.23 g *Dimension including the plating thickness Base material dimension Rev.2, May 2001, page 8 of 10 HA17324A Series Unit: mm 8.65 9.05 Max 14 8 1 1.75 Max *0.20 0.05 7 3.95 0.10 6.10 + 0.30 - 0.635 Max 1.08 0 - 8 + 0.11 1.27 *0.40 0.06 0.14 - 0.04 0.60 - 0.20 + 0.67 0.15 0.25 M Hitachi Code JEDEC EIAJ Mass (reference value) FP-14DN Conforms Conforms 0.13 g *Pd plating Rev.2, May 2001, page 9 of 10 HA17324A Series Disclaimer 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Sales Offices Hitachi, Ltd. Semiconductor & Integrated Circuits Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica Europe Asia Japan : : : : http://semiconductor.hitachi.com/ http://www.hitachi-eu.com/hel/ecg http://sicapac.hitachi-asia.com http://www.hitachi.co.jp/Sicd/indx.htm Hitachi Asia Ltd. Hitachi Tower 16 Collyer Quay #20-00 Singapore 049318 Tel : <65>-538-6533/538-8577 Fax : <65>-538-6933/538-3877 URL : http://www.hitachi.com.sg Hitachi Asia Ltd. (Taipei Branch Office) 4/F, No. 167, Tun Hwa North Road Hung-Kuo Building Taipei (105), Taiwan Tel : <886>-(2)-2718-3666 Fax : <886>-(2)-2718-8180 Telex : 23222 HAS-TP URL : http://www.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon Hong Kong Tel : <852>-(2)-735-9218 Fax : <852>-(2)-730-0281 URL : http://semiconductor.hitachi.com.hk For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe Ltd. Electronic Components Group Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 585200 Hitachi Europe GmbH Electronic Components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Copyright (c) Hitachi, Ltd., 2001. All rights reserved. Printed in Japan. Colophon 4.0 Rev.2, May 2001, page 10 of 10 |
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